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ST-QFN-16-3X3-05QFN 16-Pin, 3mm x 3mm, 0.5mm Pitch, SMD to DIP Adapter - 3 Pack
- Converts a QFN 16-Pin SMD part to a DIP form factor
- High quality PCB can withstand re-work
- Enables SMD parts to be used with a breadboard or perfboard
- 0.1\" pitch holes for standard headers
- Item sold in packs of 3 boards
SpecificationsDIP Pitch0.1\"SMD PackageQFN-16SMD Size3mm x 3mmSMD Pitch0.5mmSurface FinishENIGTemperature Rating-30°C to +100°C
This SMD to DIP breakout board enables the easy conversion of a surface mount package to a DIP form factor. This adapter makes prototyping with surface mount parts fast and easy. Through-holes with a standard 0.1\" pitch allow the board to work with common headers and enable SMD parts to be used in breadboards and perfboards. This board has an ENIG surface finish and is made of high quality FR4 which can withstand high temperature soldering and re-work. Besides the standard pins, this board also breaks out the bottom pad of a QFN part. This pad is connected to one through-hole on each side of the board labeled \"PAD\", it is also routed to a centered through-hole for quick access. The QFN bottom pad is connected through to the back side of the adapter to make soldering easier.
Mechanical DrawingsElectrical Connections
Each pin of the QFN part is electrically connected to one of the through-hole connections on the SMD to DIP adapter board. The bottom pad of the QFN part is also connected to one through hole on each side of the board.
Custom Designs
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